Chinese online media giant LeTV released its new smartphone the ‘Le Max Pro’ at its first exhibition at CES 2016 on Tuesday. This phone has established three records globally—the first phone to feature the new Qualcomm Snapdragon 820 chip, the first announced with ultrasonic fingerprint technology and the first to support the IEEE 802.11ad wireless standard, reports TechWeb.
The Le Max pro is equipped with Qualcomm’s most cutting-edge system on a chip, the Snapdragon 820. According to Qualcomm, its new flagship product adopts a 64-bit quad-core Kryo CPU, providing twice as much performance and efficiency when compared with the CPU of the Snapdragon 810.
The GPU offered on the Snapdragon 820 is the latest Adreno 530 GPU, offering a 40% improvement on graphics performance and power usage when compared to the Adreno 430. Camera capabilities have improved thanks to the inclusion of a 14-bit Qualcomm Spectra Image Signal Processor (ISP).
The Le Max Pro will also support the WiFi 802.11ad wireless networking standard. Operating in the 60 GHz band, the 802.11ad is the latest amendment to the 802.11 family. With ultra-high rate capability, lower time-lapse and less interference, it provides Wi-Fi speeds of up to 4.6Gbps (Gigabits per second) and allows for real-time 4K video streaming.
The Le Max Pro will feature the new generation of fingerprint ID technology- ultrasonic fingerprinting. This is the first time that this technology has been applied in a smartphone. Compared with other fingerprint technology, ultrasonic sensors are safer, more accurate and faster. The accuracy of ultrasonic scanning is not interfered by dirt, grease and sweat from fingers, the same cannot be said for conventional fingerprinting tech.
The Le Max Pro returns some features to the fold including a large 6.33 inch display, a bezel-less design and a metal case. It supports three of China’s most dominant mobile network operators.
LeTV also used its first appearance at CES to unveil its fourth generation TV the Max 65 Blade on Wednesday. The new TV features an ultra-thin frame at only 3.9mm through the use of Corning Iris Glass Light Guide Plate (LGP).
(Top photo from Ifanr.com.)